For this application test of soldering copper pins onto a PCB, the customer needs to define a new process for manufacturing a small PCB assembly, due to a material change for one of the components.
The customer needs to attach copper pins to a PCB (this is a small potentiometer assembly). For the current process, the customer ultrasonically welds the copper pins onto the substrate of the PCB. However, they are changing to a stiff copper pin which cannot be ultrasonically welded. This application test is to show that induction is a viable process for soldering the copper pins to the PCB, while meeting the target production rate of an average of 3 pins to one PCB every second.
SB-3/1000 Power Supply, operating up to 1 MHz
HSB-3 Heat Station
• Printed circuit board (PCB)– substrate 0.217″ (5.512mm) x 0.0197″ (.5mm) x 0.025″ (.635mm) thick plated copper
• Copper pins, 0.016″ (.406mm) diameter, 0.475″ (12.065mm) long, 3 pins per PCB (mechanically connected prior to soldering).
Power: 2.4 kW
Time: 12 sub assembly boards in 3.5 seconds
Temperature: Tested temperature 500°F (260°C) +