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Reflowing Solder on Copper Boards with Induction

///Reflowing Solder on Copper Boards with Induction
Reflowing Solder on Copper Boards with Induction2018-08-25T13:36:48+00:00

reflowing Solder

Objective
Heat small copper boards to 260°C (500°F) to reflow solder with induction in under 10 seconds using a channel coil.

Equipment
UPT S2 Power Supply
HS-4 Heat Station

Materials
• Small copper connector board with 3 pins on one side and 6 pins on the other.
• Board dimensions: 42mm x 17.5mm (1.65″ x 0.69″)

TEST 1

Key Parameters
Power: 1.87 kW
Temperature: 260°C (500°F)
Time: 10 sec.

TEST 2

Key Parameters
Power: 1.29 kW
Temperature: 260°C (500°F)
Time: 15 sec.

TEST 3

Key Parameters
Power: 4.7 kW
Temperature: 260°C (500°F)
Time: 4.4 sec.

Results:

Reflowing the solder on the copper boards was successfully accomplished in under 10 seconds using a channel induction coil. A 2 kW power supply suffices to reflow the solder in under 10 seconds, and a 5 kW power supply is able to reflow the solder in under 5 seconds.

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Request information or contact us about this application. Reference info: Application Note 3464-4581

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